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Industry

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LGO Hexagon Fused Bundles®


The LGO Hexagon Fused Bundles® offer completely new possibilities for your applications in high-power or high-temperature range. Thanks to our patented technology we are able to eliminate the inter-fiber spaces. The packaging factor of the fiber cores is thus considerably increased. This improves dramatically the transmission.

Manufacturing without any epoxy or adhesives permits a wider use of our products especially in the UV range and high-temperature range.


FIELDS OF APPLICATION:
Appropriate and optimized for your application, such as e.g.:

spectroscopy, semiconductor industry (error detection; wafer inspection), analytical instruments, pyrometry, sensor technology, UV curing

Details –
Cross Sections


Industry

to overview

LGO Hexagon Fused Bundles®



1. TECHNOLOGICAL EDGE FOR YOUR HIGH TECH APPLICATIONS
Thanks to our patented technology we are able to eliminate the inter-fiber spaces.

Details –
Cross Sections



 

Specifications

LGO Hexagon Fused Bundles® are characterized by an especially optimized packaging factor of the fiber cores. Our product offers decisive advantages, when used, in particular, for flame monitoring or other high-temperature applications up to 800°C.


Furthermore, we regard our LGO Hexagon Fused Bundles® as a high-tech solution for your UV and IR spectroscopy applications as well as a replacement for liquid light guides.


Example